Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01

Kune New simba mabhatiri emagetsi, photovoltaic inverters, mota dzemagetsi, kuchengetedza simba, IGBT, BMS bhatiri kuchengetedza mabhodhi ekudzora, nezvimwe;

Muchina uyu wekubatanidza waya waigona kuenderana nealuminium nemhangura waya yekubatanidza;

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● Batanidza waya dzakakora uye mitsetse mune imwe muchina chikuva nekutsanya hurongwa shanduko;
● Kuburikidza neiyo patented welding process control, iyo welding paramita inogona kugadziridzwa munguva chaiyo yekuchinjika zvinhu zvepasi kuti ive nechokwadi chekudzokorora welding mhando;
● Gadzirisa pachena kuburikidza nekubatanidzwa kusina musono maererano neIndasitiri 4.0/OT mitemo;
●Kuwana zvakanakisisa zvinhu zvinowirirana kuburikidza nemhando dzakasiyana-siyana dze ultrasonic frequencies kusarudza kubva, uye kukurudzira kugadzikana kwemaitiro;
● Kubatanidza tekinoroji tekinoroji uye otomatiki kubva kune imwechete sosi yekugovera.