Wire Bonding Machine
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Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01
Kune New simba mabhatiri emagetsi, photovoltaic inverters, mota dzemagetsi, kuchengetedza simba, IGBT, BMS bhatiri kuchengetedza mabhodhi ekudzora, nezvimwe;
Muchina uyu wekubatanidza waya waigona kuenderana nealuminium nemhangura waya yekubatanidza;
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Aluminium Wire Bonding Machine ye TO Series Wire Bonding -Wedge Bonding ICs/GR-W02
A Single-row TO series special waya bonding machine;
GR-W02 iwaya yekubatanidza muchina wakakodzera midziyo yemagetsi, chigadzirwa chinowirirana nemutsara mumwe kune akawanda-mutsara ultrasonic packaging uye dhizaini, iyo bonder inoshandiswa mushure mehuwandu hukuru hwekuvandudza iterative, uchishandisa yakagadzikana uye yakavimbika linear motors, inzwi coil. mota, ultrasonic masisitimu ekugadzira. Uye zvakare, iyo yakawedzera pateni yekuziva kugona kwechigadzirwa inopa indasitiri-inotungamira kubereka uye kuvimbika.
